This page decribes various projects in detail. Go back to the Resume for other information

• Identify and qualify foundry services in Asia and U.S.A for manufacturing TelCom's Integrated Circuits.
• Monitor and improve manufacturing aspects like cost, cycle time, and quality.
• Supervise the foundry engineering team

• Member of new product development team: Responsible for coordinating processing of all new products by interacting with ASIC foundry vendors.
• Foundry Qualification: Responsible for process qualification for TelCom's products requiring 0.6 mm & 1.5 mm CMOS processes at ASIC Foundries
• Involved in defining and auditing TelCom's quality requirements at Foundries

• BiPolar Process: Developed an isolation scheme and new bipolar process flow resulting in over 50% manufacturing cost reductions. Extensive process characterization was performed.
• BiCMOS Process: Headed efforts in developing a new process capability
• Dual Metal Process: Developed second layer metallization process working with in a team of four engineers

• Supported production in photo and etch processes: Bake, Spin, Align, Develop, Dry/Wet etch, Resist Strip.
• Qualified vendors for various substrates and services
• Created, modified and maintained various specifications and procedures
• Documented all process flows
• Developed and qualified deep UV bake for positive resists on Fusion photostabilizer
• Characterized epitaxial pattern shift for all BiPolar processes

   Process Integration and Miscellaneous Projects at TelCom:

• Projection Aligners: Developed projection alignment capability and converted production over to projection aligners from proximity aligners
• Facilitator between process, product, test, and quality engineering departments
• SPC Implementation: Created a custom database with user friendly interface and security features for multi-user environment. It is being used to gather and chart inline process data for the purposes of SPC implementation and process capability monitoring. This resulted in direct savings of about $200,000 by preventing the company from purchasing expensive software to perform these tasks.
• Web Page Development: Designed process engineering department web page(s). Responsible for maintaining and updating its contents.
• Gate ox integrity: Participated in gate ox integrity improvement team activities.
• Developed and implemented test limits for Electrical Test Parameters
• Contamination control: Active member of a task force responsible for identifying and containing the contamination issue which had devastating effects on the overall fab yields